MSTP 光端机 SURPASS hiT7035

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1. The physical dimensions of SURPASS hiT 7035 chassis are 403mm (wide) × 486mm
(high) × 240mm (deep) (300mm back to door), which is compliant to 19 and 21 inch
industry standards.

2. Cross Connection and Switching Capability
SURPASS hiT 7035 supports two types of cross connection and switching capabilities:
ADM-4/-1: 7.2G/2.5G CC with 1x STM-4/-1 line interface:
• HOCC: (7.2G)
• LOCC: (2.5G)
ADM-16/-4: 15.2G/5 CC with 1x STM-16/-4 line interface:
• HOCC: 15.2G
• LOCC: 5G

3. Line/Service Interface
SURPASS hiT 7035 provides the following line interfaces:
1. SDH: 1× STM-4 Optical Line Interface Board
2. SDH: 2× STM-1 Optical Interface Board
3. SDH: 2× STM-1E (W/P) Electrical Interface Card
4. SDH: 2× STM-1E PaddleCard
5. PDH: 3× E3/DS3 (W/P) interface card
6. PDH: 3× E3/DS3 Paddle
7. PDH: 63× E1 (W/P) client interface card
8. PDH: 63× E1 75ohm Paddle
9. PDH: 63× E1 120ohm Paddle
10. ATM-IMA 126xE1 interface card
11. IP/Ethernet: 8× FE/L2 interface card
12. IP/Ethernet: 8× FE/T Ethernet interface card
13. IP/Ethernet: 1× GE/T interface card
14. Optical Amplifier cards (13, 15 and 18 dBm)
15. Optical Pre-Amplifier card (20dB)

4. Advanced Data Service Support
SURPASS hiT 7035 supports the following Layer 2 data functions:
1) IEEE 802.1Q (VLAN)
2) Input information limiting
3) Class of Service
4) GFP
5) VCAT and LCAS
6) RSTP
7) Layer 2 multicast
8) ESR







5.Gb/s HO Switching Capacity and
2,5 Gb/s LO Switching Capacity with STM-1/-4 I/F
20 Gb/s HO Switching Capacity and 5 Gb/s LO Switching Capacity with STM-4/-16 I/F
TDM Services: 2M/34M/45M/STM-1/ 1+1 MSP, SNCP and 2F-BSHR  Eth/FE @ p2p/p2mp/mp2m
L2 Service MultiplexerIntegrated @ TNMS Core